28 lines
2.0 KiB
Markdown
28 lines
2.0 KiB
Markdown
---
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title: Interfacing piezoelectric inter-digitated transducers to printed circuit boards
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institute:
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- uc: University of Canterbury
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author:
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- Logan Henderson:
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institute: uc
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- Dr Joe Chen:
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institute: uc
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- Dr Ciaran Moore:
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institute: uc
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- Dr Romain Arnal:
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institute: uc
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---
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Ultrasonic interdigitated transducers (IDTs) can be used for a wide variety of sensing and transduction applications such as sonoporation @rich_sonoporation_2022, biosensing @fertier_love_2009, microfluidic mixing @shilton_nanoliter-droplet_2014 and particle manipulation @ding_-chip_2012. Packaging these actuators in lab-on-a-chip devices expands the number of applications that they can address; however, this packaging introduces the challenge of securing the fragile piezoelectric substrate, which is typically only 0.5 mm thick, to a print circuit board (PCB) that typically houses connectors and circuitry for impedance matching and amplification.
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We explore different methods of interfacing piezoelectric substrate to a fiberglass PCBs, and the resulting effects on the performance at multiple frequencies, from 10 MHz to 250 MHz by measuring the Rayleigh wave transmission. Both IDTs were attached to a vector network analyser with the response of the system measured with additional matching circuits added where needed.
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Initial results show that attaching IDT to PCBs with a two part araldite epoxy causes significant attenuation in lower frequency IDTs operating around 10MHz and less attenuation iyn higher frequenc IDTs that operate closer to 100MHz. Matching circuits were shown to have a minor effect on the output at the operating frequency, while also increasing attenuation above and below the operating frequency. This work paves the wave for the creation for higher performance and more robust ultrasonic based lab on chip devices.
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\pagebreak
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# References {.reset-citation-positions} |